Windows系统下(Linux和MAC系统下请自行了解清楚)NI的各种软件、模块、工具包、驱动程序,使用NI许可证管理器来激活的,绝大部分的都可以使用NI Lincense Activator来激活,以下链接可下载:
NI序列号Serial Number生成激活工具NI License Activator,LabVIEW/VBAI/VDM/VAS等软件模块工具包破解工具不限版本
http://pcmv.cn/thread-490-1-1.html
视觉论坛的各种资源,除了视觉相关的模块有使用外,大部分的都不会使用,所以仅提供资源不能提供技术支持。资源的下载地址一般会同时提供NI官方地址和百度网盘的下载地址。某些工具包NI的地址失效或没有NI的下载地址,那视觉论坛也没有办法,只能尝试使用百度网盘地址下载;如果百度网盘的下载地址失效过期,可联系论坛客服更新。现在NI的下载服务器对我国IP地址不是很友好,有些时候速度很慢或大的资源下载很容易出错,这样会造成安装过程各种类型报错而无法安装。建议在下载完成后,对下载资源做校验和验证(NI一般会提供MD5或SHA256等),与官方或视觉论坛提供的校验和对比,一致就可以安装,如果不一致,则需要重新下载。视觉论坛早期下载的资源,那时候NI没有这么多限制,基本上都是正常下载的资源;后期下载的资源,都与NI的正确校验和对比过,保证是正确的资源才上传到百度网盘,所以百度网盘的资源基本上是正确的。校验和工具下载地址:
文件Hash计算器FHash,文件校验和验证下载文件正确性验证,MD5值计算、SHA1值计算、SHA256值计算、CRC32值计算
http://pcmv.cn/thread-26524-1-1.html
NI Circuit Design Suite 13.0.1 Edu Win32Eng/Ger/Jpn NI电路设计套件13.0.1教学版
Circuit Design Suite(CDS)电路设计套件
电路设计套件结合了Multisim和Ultiboard软件,为电路设计、仿真、验证和布局提供了一套完整的工具。
电路设计套件为您提供了直观且经济高效的设计电路工具。您可以执行交互式SPICE仿真并无缝转换到PCB布局和布线软件。该套件专为教学、科研和设计而开发,提供了先进的仿真功能,可以让您清楚地了解电路在各种场景下的性能。
13.0.1EDU
zip
文件大小: 764063157 字节 (728.67 MB)
修改日期: 2019-06-25 02:41
MD5: ea949b0706c3ff3e9a18e12973557aae(官方正确)
SHA1: 3794b1d8e548b72f45b00b497bcea1b04484d3bc
SHA256: cd87246145bb40881bcecb3f79cb3c901bec021770bf4c2f47b781da2ac71f94
CRC32: 060ef89c
exe
文件大小: 764789592 字节 (729.36 MB)
修改日期: 2014-03-20 16:30
MD5: 8a236e7b3c42c236c75fc2191f8e2778
SHA1: ad4cadc94911639776c5d71be94310afc6bad3f7
SHA256: d535a70b99b73a0c851a0ef090ddce02a9c8da21b9b96efe0ce83aa2bd087153
CRC32: 9a238426
百度网盘与NI官方下载地址:
NI Circuit Design Suite 13.0.1 Edu Win32Eng/Ger/Jpn NI电路设计套件13.0.1教学版
http://pcmv.cn/thread-26715-1-1.html?fromuid=9
(出处: 机器视觉论坛)
NI Circuit Design Suite 13.0.1 Readme for Windows
Supported Platforms
NI Circuit Design Suite Drops Support for Microsoft Windows Vista, Windows XP, and Windows Server 2003 in 2016
Installing Circuit Design Suite 13.0.1Installing Multiple Versions
Archiving Circuit Design Suite databases
Uninstalling
Circuit Design Suite 13.0.1 Updates and Notifications
Automating the Installation of NI Products
For more information on silent installations of individual NI products, refer to KB 4CJDP38M, Automating the Installation of a Single Installer.
For more information on silent installations of suited NI products, such as NI Developer Suite, refer to KB 4GGGDQH0, Automating the Installation of a Suited Installer.
To determine what version of NI Installers your product contains, refer to KB 4CJDR18M, How Can I Determine the Type and Version of My National Instruments Installer?.
How to Use NI Software with Microsoft Windows 8
Using NI Launcher
Pinning Frequently Used Applications
Current Application | Icon Location | Pin to Action |
Windows 8 Desktop | Desktop Taskbar | Right-click application and select Pin to Taskbar |
Windows 8 Desktop | Start screen | Right-click application and select Pin to Start |
Windows 8 Start screen | Desktop Taskbar | Right-click application and select Pin to taskbar from the menu bar on the bottom of the screen |
Finding All Programs
Product Security and Critical Updates
Known IssuesLabVIEW
Windows Vista
Circuit Design Suite
Bug Fixes
Multisim ( 30 ) | |
Bug ID | Description |
351776 | Printing in Black and White removes text. |
383114 | Hyphen in model name prevents table view of SPICE parameters. |
448013 | Cannot unpack projects to another drive location other than where it was created from. |
451958 | Adding a model from a component can cause mapping errors. |
453679 | RefDes sometimes becomes incorrect after gate swaps and gate optimizations from the Advanced RefDes configuration dialog. |
452928 | Annotation sometimes does not find a specific footprint and will pick an incorrect footprint instead. |
351727 | Editing a selection font, changes font of all components placed after it. |
451442 | Swapping sections with different models for a multisection component will lead to errors. |
443556 | Netlist view window sometimes does not display data after selecting regenerate netlist. |
366729 | Pasting different connector types with the same name to a new design renames the connectors. |
447805 | Swapping RefDes's using Advanced RefDes Configuration will sometimes produce duplicate RefDes's. |
358433 | The lock subcircuit restriction does not seem to apply to hierarchical blocks. |
429068 | In a multisection component, changing its footprint pinout breaks mappings for any sections from there on. |
439226 | Ladder diagram fails to simulate due to large resistor in NC and NO contacts. |
445183 | Unable to replace the footprint of an interactive component from the spreadsheet view. |
440274 | Multisim Full edition should not have the Model Maker button active. |
445770 | Back annotating to Multisim when a component is not found in the database will sometimes lead to a crash. |
443648 | DC operating point failure fallback method sometimes produces inconsistent results. |
443867 | Cannot replace a multisection component after the third attempt. |
443230 | Netlist errors when one section of a component doesn't have a model. |
274991 | The size of a model seems to affect the time it takes to open its property window. |
274589 | Component wizard does not warn user if .subckt is not terminated with .ends. |
442364 | RefDes duplication sometimes happens after component replace. |
441098 | Interactive DC sources sometimes do not preserve slider position on import. |
423563 | SVG circles are always imported with radii multiple of 3 with OECL import. |
429474 | Negative temperature coefficient for a resistor is causing simulation error. |
438559 | Sometimes Multisim is unable to edit the user fields for a corporate database. |
274687 | Multisim does not import OrCAD file correctly sometimes. |
435191 | IRAM section of MCU memory view is not being displayed properly. |
422933 | Multisim cannot communicate with some boards using Xilinx ISE 12.4. |
Ultiboard ( 19 ) | |
Bug ID | Description |
456570 | Some landpattern changes in Ultiboard sometimes do not correctly backannotate to Multisim. |
456503 | 3D DXF files do not export board thickness correctly. |
452986 | NC Drill settings are not restored from scheme file if NC drill window is open. |
453023 | Cancelling netlist editor dialog makes hidden changes to grouped net settings. |
453286 | Net settings for clearances does not always properly adhered to. |
450388 | Ultiboard design file sometimes gets corrupted after importing a bitmap file. |
450425 | Ultiboard security copy file sometimes gets overwritten by a corrupt file. |
449740 | Trace width changes in Net Group dialog not working for Edu, Full or Student tiers. |
447448 | Forward annotating a file with a ground net may sometimes lead to a crash. |
443872 | Unable to ungroup a group comprising of only attributes. |
443838 | Number of layers in the place powerplane dialog box doesn't match the design toolbox. |
447750 | A DRC is not generated whenever a trace crosses a round board outline and a net. |
442363 | Text attributes disappear when multiple text attributes are grouped together. |
440757 | Gerber files are sometimes being exported incorrectly due to default imperial precisions. |
439841 | DXF data doesn't appear on the workspace when the 'closed polyline to polygon" is checked. |
439868 | Creating a rounded rectangle custom pad image with modified xy coordinates will not show it properly once placed. |
440292 | Autorouter sometimes does not work correctly with custom pads. |
443226 | Swapping layers no longer auto deleting vias. |
406117 | Confusing Labels In Select Groups for Replica Place Dialog. |
New ComponentsADI
Avago Technologies
Efficient Power Conversion (EPC)
Infineon
Maxim
Microchip
NXP Semiconductors
ON Semiconductor
Texas Instruments
Vishay
Important InformationCopyright
Notices are located in the <National Instruments>_Legal Information and <National Instruments> directories.
EULAs are located in the <National Instruments>SharedMDFLegallicense directory.
Review <National Instruments>_Legal Information.txt for information on including legal information in installers built with NI products.